Micro-bead blasting process for removing a silicone flash layer

An apparatus comprising:

• a trace layer on a substrate;
• a light emitting diode die that is electrically coupled to the trace layer;
• a dielectric material disposed over the trace layer, wherein a contact pad is formed on the trace layer by an opening in the dielectric material;
• and
• a layer of silicone disposed over the light emitting diode, wherein the layer of silicone forms an edge around the contact pad, wherein the layer of silicone contains a trace amount of a blasting medium at the edge, and wherein the blasting medium is taken from the group consisting of:
• sodium bicarbonate, sodium sulfate and ammonium bicarbonate.

An apparatus comprising:

• a substrate with a top surface and side edges;
• contact pads disposed on the top surface of the substrate;
• a light emitting diode (LED) die disposed on the top surface of the substrate, wherein electrical connections to the LED die are made only through the contact pads;
• and
• a compression molded lens formed over the LED die, wherein the compression molded lens is made of a material that extends to each of the side edges of the substrate and that is disposed over substantially all of the top surface of the substrate except for laterally above portions of the contact pads.