Semiconductor light emitting device
AssigneeKabushiki Kaisha Toshiba
InventorsYasuhiko Akaike, Shinji Nunotani, Kazuyoshi Furukawa
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Abstract
A semiconductor light emitting device is provided that includes a support substrate, a first metal layer formed on the support substrate, a transparent conductive layer formed on the first metal layer, a second metal layer embedded in the transparent conductive layer, and a semiconductor light emitting layer formed on the transparent conductive layer. A reflectance of the second metal layer to light emitted by the semiconductor light emitting layer is higher than a reflectance of the first metal layer to light emitted by the semiconductor light emitting layer.
Claims20
A semiconductor light emitting device, comprising:
- a support substrate;
- a first metal layer formed on the support substrate;
- a transparent conductive layer formed on the first metal layer;
- a second metal layer embedded in the transparent conductive layer, such that edges of the second metal layer are not exposed;
- and
- a semiconductor light emitting layer formed on the transparent conductive layer.
A semiconductor light emitting device, comprising:
- a support substrate;
- a first metal layer formed on the support substrate;
- a transparent conductive layer formed on the first metal layer;
- a second metal layer embedded in the transparent conductive layer, a width of the second metal layer being less than a width of the first metal layer;
- and
- a semiconductor light emitting layer formed on the transparent conductive layer.
A method of manufacturing a semiconductor light emitting device, the method comprising:
- forming a support substrate;
- forming a first metal layer on the support substrate;
- forming a second metal layer on the first metal layer to have a width that is narrower than that of the first metal layer;
- and
- forming a transparent conductive layer on the second metal layer and on the first metal layer around edges of the second metal layer;
- and
- forming a semiconductor light emitting layer on the transparent conductive layer.
Dependencies are inferred from the claim text.