Heating unit, substrate processing apparatus, and method for heating fluid
AssigneeTokyo Electron Limited
InventorsHideaki Sato, Hiromi Hara
Life of this patent
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AssigneeTokyo Electron Limited
InventorsHideaki Sato, Hiromi Hara
Estimating the term…
In a heating unit, based on a required output amount Q, a control part 50 performs: (A) when the required output amount Q is not more than a predetermined set value, a control in which none of the heating devices 24a is continuously kept on throughout a heating cycle, and all or one or more heating devices 24a are controlled in a periodically divided manner; and (B) when the required output amount is larger than the predetermined set value, a control in which all or one or more heating devices 24a are continuously kept on throughout the heating cycle, and all or one or more heating devices 24a among the remaining heating devices 24a are controlled in the periodically divided manner during this heating cycle. At this time, a difference between the maximum number and the minimum number of the heating devices 24a that are simultaneously kept on during the heating cycle is made not more than 1.
A heating unit configured to heat a fluid, the heating unit comprising:
A method for heating a fluid by means of a heating unit including a plurality of heating devices respectively configured to heat the fluid, the method comprising:
Dependencies are inferred from the claim text.