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AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsSang Won Yoon, Satoshi Yasuda, Koji Shiozaki
Estimating the term…
Devices, methods and systems are disclosed herein to describe the wettability characteristics of the material forming a bonding area, a non-bonding area, and a melted bonding material. The melted bonding material may have a high degree of cohesion and may result in a very high contact angle (e.g., between 90°- 180°) in the non-bonding area thereby preventing or limiting the flow of a melted material into the non-bonding area, which often results when the melted bonding material forms a low contact angle (e.g., between 0°-90°) in the bonding area. In other words, by choosing a material for the non-bonding area to have low wettability characteristics when compared to the melted materials of the bonding area or by treating the material forming the non-bonding area to have much lower wettability characteristics, the melted materials of the bonding area may be prevented from flowing into the non-bonding area.
An apparatus formed as a result of a transient liquid phase (TLP) bonding process, the apparatus comprising:
An assembly formed as a result of transient liquid phase (TLP) bonding of a substrate to a die, the assembly comprising:
Dependencies are inferred from the claim text.