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US 8,802,999 B2Granted
Embedded printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJong In Ryu, Yul Kyo Chung, Tae Sung Jeong
Life of this patent
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Abstract
An embedded printed circuit board (PCB) includes: a copper foil laminate; an internal electronic component inserted into the copper foil laminate; a first circuit pattern formed on a surface of the internal electronic component; and a second circuit pattern formed on the copper foil laminate.
Claims10
An embedded printed circuit board (PCB) comprising:
- a copper foil laminate;
- an internal electronic component inserted into the copper foil laminate;
- a first circuit pattern formed on a surface of the internal electronic component;
- and
- a second circuit pattern formed on the copper foil laminate.
2 more elements
A method for manufacturing an embedded printed circuit board (PCB), the method comprising:
- forming a cavity in a copper foil laminate;
- inserting an internal electronic component into the cavity;
- forming a first circuit pattern on the internal electronic component;
- laminating the copper foil laminate;
- forming a via hole in the copper foil laminate;
- and
- forming a second circuit pattern on the copper foil laminate.
4 more elements
Dependencies are inferred from the claim text.