Ceramic multilayer substrate and method for producing the same

A ceramic multilayer substrate comprising:

• a ceramic laminate in which a plurality of ceramic layers are stacked;
• an internal conductor disposed in the ceramic laminate;
• a surface electrode disposed on a principal surface of the ceramic laminate;
• a terminal electrode;
• a connecting electrode;
• and
• a chip-type ceramic component bonded to the internal conductor or the surface electrode through the terminal electrode;
• wherein
• the internal conductor and the surface electrode include a first metal material as a main constituent;
• the terminal electrode includes a second metal material as a main constituent that does not form a solid solution with the first metal material;
• the internal conductor or the surface electrode is bonded to the terminal electrode through the connecting electrode, and the connecting electrode has a composition that forms a solid solution with both of the first metal material and the second metal material;
• the connecting electrode includes the first metal material as a main constituent and a third metal material as a minor constituent;
• the connecting electrode includes about 72% to about 76% by weight of the first metal material and about 0.8% to about 4% by weight of the third metal material;
• the first metal material is Ag, the second metal material is Ni, and the third metal material forms a solid solution with each of Ag and Ni;
• and
• the connecting electrode includes boron and does not include the second metal material.