Wiring board and mounting structure thereof
AssigneeKYOCERA Corporation
InventorKatsura Hayashi
Life of this patent
Estimating the term…
Abstract
A wiring board according to an embodiment includes an inorganic insulating layer provided with a via-hole which is a penetrating hole, and a via-conductor which is a penetrating conductor disposed inside the via-hole. The inorganic insulating layer includes first inorganic insulating particles connected to each other and second inorganic insulating particles that are larger in particle size than the first inorganic insulating particles and are connected to each other via the first inorganic insulating particles, and also has, at an inner wall of the via-hole V, a protrusion including at least part of the second inorganic insulating particle. The protrusion is covered with the via-conductor.
Claims9
A wiring board, comprising:
- an inorganic insulating layer provided with a penetrating hole;
- and
- a penetrating conductor disposed inside the penetrating hole,
- wherein the inorganic insulating layer includes first inorganic insulating particles connected to each other and second inorganic insulating particles that are larger in particle size than the first inorganic insulating particles and are connected to each other via the first inorganic insulating particles, the inorganic insulating layer having, at an inner wall of the penetrating hole, a protrusion including at least part of the second inorganic insulating particle, and
- the protrusion is covered with the penetrating conductor.
Dependencies are inferred from the claim text.