Printed circuit board and method of manufacturing the same
AssigneeNitto Denko Corporation
InventorsJun Ishii, Daisuke Yamauchi
Life of this patent
Estimating the term…
Abstract
An insulating layer is formed on a support substrate having a conductive property. Write wiring traces, read wiring traces, and first and second electrode pad pairs are formed on the insulating layer. The first electrode pad pair is connected to the write wiring traces. The second electrode pad pair is connected to the read wiring traces. Parts of regions of the support substrate, which overlap the electrode pads, are removed. Thus, openings are formed in the regions of the support substrate, which overlap the electrode pads.
Claims6
A printed circuit board that can be electrically connected to an external circuit, comprising:
- a support substrate formed of a conductive material;
- a first insulating layer formed on said support substrate;
- a plurality of wiring traces formed on said first insulating layer;
- and
- a plurality of connection terminals that are respectively formed in parts of said plurality of wiring traces on said first insulating layer and can be electrically connected to said external circuit,
- wherein one or a plurality of openings are formed in said support substrate to at least partially overlap one or more of said plurality of connection terminals,
- said plurality of connection terminals include first and second connection terminals,
- said one or plurality of openings include one or a plurality of first openings that at least partially overlap said first connection terminal and one or a plurality of second openings that at least partially overlap said second connection terminal, and
- the sum of the areas of said one or plurality of first openings that overlap said first connection terminal and the sum of the areas of said one or plurality of second openings that overlap said second connection terminal differ.
A printed circuit board that can be electrically connected to an external circuit, comprising:
- a support substrate formed of a conductive material;
- a first insulating layer formed on said support substrate;
- a plurality of wiring traces formed on said first insulating layer;
- and
- a plurality of connection terminals that are respectively formed in parts of said plurality of wiring traces on said first insulating layer and can be electrically connected to said external circuit,
- wherein one or a plurality of openings are formed in said support substrate to at least partially overlap one or more of said plurality of connection terminals, and
- said one or plurality of openings are formed so that a characteristic impedance of one of said plurality of connection terminals is lower than a characteristic impedance of the other connection terminals.
A method for manufacturing a printed circuit board that can be electrically connected to an external circuit, comprising the steps of:
- preparing a laminated structure of a support substrate having a conductive property and an insulating layer;
- forming a plurality of wiring traces on said insulating layer while forming a plurality of connection terminals, which can be electrically connected to said external circuit in parts of said plurality of wiring traces, respectively;
- and
- forming one or a plurality of openings in said support substrate to at least partially overlap one or more of said plurality of connection terminals,
- wherein the step of forming said openings includes forming said one or plurality of openings so that a characteristic impedance of one of said plurality of connection terminals is lower than a characteristic impedance of the other connection terminal.
Dependencies are inferred from the claim text.