Conductive material and connection structure
AssigneeSekisui Chemical Co., Ltd.
InventorsHideaki Ishizawa, Takashi Kubota
Life of this patent
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Abstract
The conductive material according to the present invention includes a binder resin and conductive particles each having a solder at a conductive surface, the binder resin includes a curable compound capable of being cured by heating, and a thermal curing agent, and when the binder resin and the solder in the conductive particle are each heated at a temperature rising rate of 10° C./minute to perform differential scanning calorimetry, an exothermic peak top temperature in curing of the binder resin is lower than an endothermic peak top temperature in melting of the solder.
Claims12
A conductive material comprising:
- a binder resin;
- and conductive particles each having a solder at a conductive surface,
- wherein the binder resin comprises a curable compound capable of being cured by heating, and a thermal curing agent, and
- an exothermic peak top temperature in curing of the binder resin is lower than an endothermic peak top temperature in melting of the solder, when the binder resin and the solder in the conductive particles are each heated at a temperature rising rate of 10° C./minute to perform differential scanning calorimetry.
Dependencies are inferred from the claim text.