Loading patent…
AssigneeDexerials Corporation
InventorsTaichi Koyama, Hironobu Moriyama, Takashi Matsumura, Takayuki Saito
Estimating the term…
An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet. The manufacturing method also includes a temporary loading step of temporarily loading a semiconductor chip (3) and capacitors (4a) to (4d) on the epoxy resin composition (2) and an ultimate pressure bonding step of pressuring the semiconductor chip (3) and capacitors (4a) to (4d) by a thermal bonding head (20) in situ to ultimately pressure bond the semiconductor chip (3) and capacitors (4a) to (4d).
An epoxy resin composition containing a novolak phenolic curing agent, an acrylic elastomer, an epoxy resin and an inorganic filler, wherein,
A method for producing a composite unit comprising the steps of
A composite unit composed by an electronic component and a printed circuit board bonded together by an epoxy resin composition;
A method for producing a composite unit comprising the steps of
Dependencies are inferred from the claim text.