Composition and methods of forming solder bump and flip chip using the same
AssigneeElectronics and Telecommunications Research Institute
InventorsYong Sung Eom, Jong Tae Moon, Sangwon Oh, Keonsoo Jang
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Abstract
Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
Claims5
A method of forming a solder bump, comprising:
- providing a first composition on a substrate including a conductive pattern, the first composition comprising a low melting point solder, a thermo-curable polymer resin, and a curing agent of an anhydride family;
- forming a solder pattern on the conductive pattern by agglomerating the low melting point solder;
- removing the first composition comprising the low melting point solder which is not agglomerated on the conductive pattern;
- providing a second composition on the substrate, the second composition comprising a photo-curable material;
- forming a film by curing the second composition;
- and
- planarizing the film to expose the solder pattern.
A method of forming a solder bump, comprising:
- providing a first composition on a substrate including a conductive pattern, the first composition comprising a low melting point solder, a thermo-curable polymer resin, and a curing agent of an anhydride family;
- forming a solder pattern on the conductive pattern by agglomerating the low melting point solder;
- removing the first composition comprising the low melting point solder which is not agglomerated on the conductive pattern;
- providing a second composition on the substrate, the second composition comprising a thermal curable polymer resin;
- forming a film by curing the second composition;
- and
- planarizing the film to expose the solder pattern.
A method of forming a solder bump, comprising:
- providing a first composition on a substrate including a conductive pattern, the first composition comprising a low melting point solder, a thermo-curable polymer resin, and a curing agent of an anhydride family;
- and
- forming a solder pattern on the conductive pattern by agglomerating the low melting point solder,
- before the forming of the solder pattern, further comprising:
- performing an exposure process to define a region to be removed and a remaining region on a film formed of the first composition;
- and
- removing the region to be removed, wherein the first composition further comprises a photo-curable material.
Dependencies are inferred from the claim text.