Method of fabricating a semiconductor device

A method of fabricating a semiconductor device, comprising:

• forming a plurality of patterns over a substrate;
• forming a first layer of a multi-layer patterning scheme over the substrate, wherein the first layer includes an organic layer free of thermal treatment and in physical contact with the substrate, and wherein the organic layer includes an un-cross-linked material;
• polishing the organic layer prior to any thermal treatment, wherein the polishing process planarizes a surface of the organic layer;
• depositing a second layer of the multi-layer patterning scheme over the planarized surface of the organic layer, wherein the second layer includes a low temperature film, and wherein an etching selectivity exists between the low temperature film and the organic layer;
• and
• forming a third layer of the multi-layer patterning scheme over the second layer, wherein the third layer includes a photoresist layer.

A method of fabricating a semiconductor device, comprising:

• forming a plurality of circuit devices over a substrate, wherein the plurality of circuit devices include a conductive feature;
• forming an un-cross-linked organic layer over the substrate, wherein the un-cross-linked organic layer includes a portion that physically contacts the conductive feature, wherein the un-cross-linked organic layer is a first layer of a multi-layer patterning scheme, and wherein the multi-layer patterning scheme is used to perform a lithography process;
• polishing the un-cross-linked organic layer prior to any thermal treatment to planarize a surface of the un-cross-linked organic layer;
• depositing a solvent-free low temperature film over the planarized surface of the un-cross-linked organic layer, wherein the solvent-free low temperature film is a second layer of the multi-layer patterning scheme;
• and
• forming a patterned photoresist layer over the solvent-free low temperature film, wherein the patterned photoresist layer is a third layer of the multi-layer patterning scheme.