Method of manufacturing a semiconductor component

A method of manufacturing a semiconductor component by means of the following steps:

• manufacturing of a wafer,
• applying structures of components on the wafer to form a wafer assembly,
• applying a metal coating on the wafer,
• removing the metal coating in non-contact areas of the components,
• applying surrounds on the edge areas of the components,
• arranging the wafer on a foil held by a clamping ring,
• separating the components of the wafer compound carried by the foil from one another,
• arranging a covering mask on the areas of the separated components carried by the foil which are not to be coated,
• applying a metal coating on the separate components covered with the mask,
• removal of the mask, and
• removal of the components from the foil and further processing the separate components,
• wherein applying a metal coating on the separate components covered by the mask takes place by means of thermal spraying, the thermal spraying occurring by means of nano-powder plasma depositing.