Combination of a substrate and a wafer
OwnerErich Thallnerinventor
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Abstract
The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer.
Claims9
A method for handling a substrate for temporarily bonding to a wafer, the method comprising the step of:
- fixing the wafer on the substrate by applying a first fluid adhesive layer that contacts at least an outer peripheral edge of the substrate before the bonding process and a second fluid adhesive layer that contacts at least the outer peripheral edge of the wafer before the bonding process.
A method for handling a substrate for temporarily bonding to a wafer, the method comprising the steps of:
- applying a first polymer or epoxy adhesive layer to at least an outer peripheral edge of the substrate;
- applying a second polymer or epoxy adhesive layer to at least an outer peripheral edge of the wafer;
- and
- bonding the substrate to the wafer by placing the first polymer or epoxy adhesive layer into contact with the second polymer or epoxy adhesive layer.
A method for handling a substrate for temporarily bonding to a wafer, the method comprising the steps of:
- applying a first fluid adhesive layer to at least an outer peripheral edge of the substrate;
- applying a second fluid adhesive layer to at least an outer peripheral edge of the wafer wherein an outer diameter of the second fluid adhesive layer corresponds to the outer diameter of the wafer;
- and
- bonding the substrate to the wafer by placing the first polymer or epoxy adhesive layer into contact with the second polymer or epoxy adhesive layer.
A method for handling a substrate for temporarily bonding to a wafer, the method comprising the steps of:
- applying a first fluid adhesive layer to at least an outer peripheral edge of the substrate wherein the first fluid adhesive layer forms a closed ring disposed at the outer peripheral edge of the substrate;
- applying a second fluid adhesive layer to at least an outer peripheral edge of the wafer wherein the second fluid adhesive layer forms a closed ring disposed at the outer peripheral edge of the wafer;
- and
- bonding the substrate to the wafer by placing the first polymer or epoxy adhesive layer into contact with the second polymer or epoxy adhesive layer.
Dependencies are inferred from the claim text.