Method of manufacturing a semiconductor device and a semiconductor device produced thereby
AssigneeDow Corning Toray Co., Ltd.
InventorsMinoru Isshiki, Tomoko Kato, Yoshitsugu Morita, Hiroshi Ueki
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Abstract
A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.
Claims18
A method of manufacturing a semiconductor device sealed in a cured silicone body, the method comprising the steps of:
- placing an unsealed semiconductor device into a mold;
- and
- subjecting a curable silicone composition which is fed into a space between the mold and the unsealed semiconductor device to compression molding;
- wherein the curable silicone composition comprises at least the following components:
- (A) an epoxy-containing silicone
- and
- (B) a curing agent for an epoxy resin;
- and wherein component (A) is (A1) an organosiloxane which contains in one molecule at least two epoxy-containing univalent organic groups and which is represented by average unit formula:
- (R13SiO1/2)a(R22SiO2/2)b(R3SiO3/2)c
- wherein R1, R2, and R3 may be the same or different and designate optionally substituted univalent hydrocarbon groups or epoxy-containing univalent groups, with the proviso that 20 mole % or more of R3's are aryl groups;
- and “a”, “b”, and “c” are numbers which satisfy the following conditions:
- 0≦a≦0.8;
- 0≦b≦0.8;
- 0.2≦c≦0.9;
- and (a+b+c)=1;
- and/or
- (A2) a diorganosiloxane represented by the following general formula:
- A-R5—(R42SiO)mR42Si—R5-A
- wherein R4's designate optionally substituted univalent hydrocarbon groups which are free of unsaturated aliphatic bonds;
- R5's designate bivalent organic groups;
- and A's designate siloxane residual radicals represented by the following average unit formula:
- (XR42SiO1/2)d(SiO4/2)e
- wherein R4 is the same as defined above;
- X is a single bond for bonding to R5, a hydrogen atom, a group represented by R4, an epoxy-containing univalent organic group, or an alkoxysilylalkyl group, with the proviso that at least one X of the above formula is a single bond and at least two X's are epoxy-containing univalent organic groups;
- “d” is a positive number;
- “e” is a positive number;
- and “d/e” is a positive number between 0.2 and 4;
- and “m” is an integer equal to or greater than 1.
Dependencies are inferred from the claim text.