Integrated circuit packaging system with island terminals and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Henry Descalzo Bathan, Emmanuel Espiritu, Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package paddle; mounting an integrated circuit on the paddle top side; and forming an encapsulation within the upper hole.
Claims22
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package paddle having a peripheral portion, a central portion, and an upper hole, wherein the peripheral portion is spaced away from the central portion, and the upper hole is below a paddle top side, horizontally between the peripheral portion and the central portion, and bounded by an upper non-horizontal side with a curve surface;
- forming a terminal adjacent the package paddle;
- mounting an integrated circuit on the paddle top side;
- and
- forming an encapsulation within the upper hole.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package paddle having a peripheral portion, a central portion, and an upper hole, wherein the peripheral portion is spaced away from the central portion, and the upper hole is below a paddle top side, horizontally between the peripheral portion and the central portion, and bounded by an upper non-horizontal side with a curve surface;
- forming a terminal adjacent the package paddle;
- mounting an integrated circuit on the paddle top side;
- attaching a terminal-device connector to the integrated circuit and the terminal;
- and
- forming an encapsulation within the upper hole.
An integrated circuit packaging system comprising:
- a package paddle having a peripheral portion, a central portion, and an upper hole, wherein the peripheral portion is spaced away from the central portion, and the upper hole is below a paddle top side, horizontally between the peripheral portion and the central portion, and bounded by an upper non-horizontal side with a curve surface;
- a terminal adjacent the package paddle;
- an integrated circuit on the paddle top side;
- and
- an encapsulation within the upper hole.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package paddle having a peripheral portion, a central portion, a paddle bottom side, a paddle bottom conductive layer, and a lower non-horizontal side with the lower non-horizontal side having a curve surface, wherein the peripheral portion is spaced away from the central portion, and the upper hole is horizontally between the peripheral portion and the central portion surface;
- forming a terminal adjacent the package paddle, the terminal having a terminal bottom side and a terminal lower portion with the terminal lower portion having a non-horizontal extent facing the lower non-horizontal side;
- mounting an integrated circuit over the package paddle;
- and
- forming an encapsulation over the integrated circuit, the encapsulation covering the non-horizontal extent and the lower non-horizontal side, the encapsulation having an encapsulation bottom side horizontally extending from the paddle bottom side to the terminal bottom side.
An integrated circuit packaging system comprising:
- a package paddle having a peripheral portion, a central portion, a paddle bottom side, a paddle bottom conductive layer, and a lower non-horizontal side with the lower non-horizontal side having a curve surface, wherein the peripheral portion is spaced away and the upper hole is horizontally between the peripheral portion and the central portion;
- a terminal adjacent the package paddle, the terminal having a terminal bottom side and a terminal lower portion with the terminal lower portion having a non-horizontal extent facing the lower non-horizontal side;
- an integrated circuit over the package paddle;
- and
- an encapsulation over the integrated circuit, the encapsulation covering the non-horizontal extent and the lower non-horizontal side, the encapsulation having an encapsulation bottom side horizontally extending from the paddle bottom side to the terminal bottom side.
Dependencies are inferred from the claim text.