Integrated circuit packaging system with leads and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Tai Do, Linda Pei Ee Chua, Gai Leong Lai
Life of this patent
Estimating the term…
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a die paddle, having paddle projections along a paddle peripheral side; forming a lead terminal having a lead extension with the lead extension extending towards the paddle peripheral side and between the paddle projections; mounting an integrated circuit over the die paddle; connecting the integrated circuit and the lead extension; and forming an encapsulation over the die paddle and covering the integrated circuit and lead extension.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a die paddle, having, paddle plating paddle projections along a paddle peripheral side;
- forming a lead terminal having a lead extension with the lead extension extending towards the paddle peripheral side and between the paddle projections;
- mounting an integrated circuit over the die paddle;
- connecting the integrated circuit and the lead extension;
- connecting the integrated circuit and the paddle plating, wherein the paddle plating is a contiguous ring along the paddle peripheral side and around the integrated circuit;
- forming an encapsulation over the die paddle and covering the integrated circuit and lead extension;
- and
- connecting the die paddle with a tie bar at a corner of the die paddle along the paddle peripheral side, the tie bar extending outwardly in a diagonal orientation from the die paddle.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a die paddle, having a paddle plating and paddle projections along a paddle peripheral side;
- forming a lead terminal having a lead body and a lead extension extending from the lead body, the lead extension extending towards the paddle peripheral side and between the paddle projections;
- mounting an integrated circuit over the die paddle;
- connecting the integrated circuit and the lead extension;
- connecting the integrated circuit and the paddle plating, wherein the paddle plating is a contiguous ring along the paddle peripheral side and around the integrated circuit;
- forming an encapsulation over the die paddle and the lead body and covering the integrated circuit and the lead extension;
- and
- connecting the die paddle with a tie bar at a corner of the die paddle along the paddle peripheral side, the tie bar extending outwardly in a diagonal orientation from the die paddle.
An integrated circuit packaging system comprising:
- a die paddle having a paddle plating and paddle projections along a paddle peripheral side;
- lead terminal having a lead extension with the lead extension extending towards the paddle peripheral side and between the paddle projections;
- an integrated circuit mounted over die paddle and connected to the paddle plating and the lead extension, wherein the paddle plating is a contiguous ring along the paddle peripheral side and around the integrated circuit;
- an encapsulation over the die paddle and covering the integrated circuit and lead extension;
- and
- connecting the die paddle with a tie bar at a corner of the die paddle along the paddle peripheral side, the tie bar extending outwardly in a diagonal orientation from the die paddle.
Dependencies are inferred from the claim text.