Method of manufacturing semiconductor package having no chip pad

A method of manufacturing a semiconductor package having no chip pad, the method comprising:

• preparing a polyimide tape on which an adhesive layer is arranged;
• forming lead members on the adhesive layer so as to form a plurality of semiconductor packages in a matrix form;
• attaching the polyimide tape to a carrier;
• performing wire bonding to mount semiconductor chips on the polyimide tape and connect the lead members and the semiconductor chips;
• forming an encapsulation member to encapsulate the semiconductor chips, the lead members, and wires;
• detaching the encapsulation member from the carrier and the polyimide tape;
• forming conductive layers each on a surface of the lead members exposed through a surface of the encapsulation member;
• and
• performing a singulation process on the encapsulation member with the conductive layers formed thereon to define unit semiconductor packages,
• wherein the forming of the lead members comprises attaching a copper layer on the adhesive layer on the polyimide tape and etching the copper layer to form a plurality of leads.