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US 8,802,494 B2Granted
Method of fabricating a semiconductor device having an interposer
AssigneeAmkor Technology Korea, Inc.
InventorsChoon Heung Lee, Ki Cheol Bae, Do Hyun Na
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Abstract
The method of fabricating a semiconductor device may include forming a semiconductor die on a substrate, forming an interposer including at least one integrated circuit connected to the semiconductor die on the substrate or on the semiconductor die, and performing encapsulation to surround the semiconductor die and the interposer.
Claims3
A method of fabricating a semiconductor device, the method comprising:
- forming a semiconductor die on a substrate, wherein the semiconductor die comprises through electrodes passing through the semiconductor die;
- forming an interposer including at least one integrated circuit connected to the semiconductor die therein on the substrate or on the semiconductor die;
- coupling side interposers electrically on the sides of at least one of the semiconductor die and interposer;
- and
- performing encapsulation to surround the semiconductor die, the interposer, and the side interposers.
2 more elements
Dependencies are inferred from the claim text.