Pressure sensor and method of packaging same
AssigneeFreescale Semiconductor, Inc.
InventorsJinzhong Yao, Wai Yew Lo, Lan Chu Tan, Xuesong Xu
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Abstract
A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.
Claims10
A method of packaging a pressure sensor die, comprising the steps of:
- providing a lead frame having at least one die pad and a plurality of lead fingers;
- attaching a tape to a first side of the lead frame;
- attaching a pressure sensor die to the at least one die pad on a second side of the lead frame;
- electrically connecting bond pads of the pressure sensor die to the lead fingers of the lead frame;
- dispensing an encapsulating material onto the second side of the lead frame with a glob top dispensing process, wherein the encapsulating material covers the lead fingers and the electrical connections thereto and fills gaps between the die pad and the lead fingers;
- dispensing a gel onto a top surface of the pressure sensor die, wherein the gel covers the die bond pads and the electrical connections thereto;
- attaching a lid to the lead frame, wherein the lid covers the pressure sensor die and the gel thereon;
- and
- curing the encapsulating material and the gel.
A method of packaging a pressure sensor die, comprising the steps of:
- providing a lead frame having a die pad, a plurality of lead fingers that surround the die pad, and tie bars that extend outwardly from corners of the die pad;
- attaching a tape to a first side of the lead frame;
- attaching a pressure sensor die and a second die to the die pad adjacent to each other on a second side of the lead frame;
- electrically connecting bond pads of the pressure sensor die and the second die to respective ones of the lead fingers of the lead frame with wire bonds via a wire bonding process;
- dispensing an encapsulating material onto the second side of the lead frame that covers the lead fingers, the wire bonds thereto, and fills gaps between the die pad and the lead fingers;
- dispensing a gel onto a top surface of the pressure sensor die and the second die, wherein the gel covers bond pads on the pressure sensor die and the second die and the wire bonds thereto;
- attaching a lid to the lead frame, wherein the lid covers the pressure sensor die, the second die, the bond wires and the gel, and wherein the lid penetrates the encapsulating material and contacts the tie bars but is electrically isolated from the lead fingers;
- and
- curing the encapsulating material and the gel.
Dependencies are inferred from the claim text.