Method of manufacturing encapsulation structure for encapsulating LED chip

#1. Technical Field

#The present disclosure relates to semiconductor packages, and particularly to an LED (light emitting diode) package with a high uniformity of light illumination.

#2. Description of the Related Art

#FIG. 1 is a cross section of an LED package in accordance with a first exemplary embodiment of present disclosure, wherein the LED package includes a substrate, an LED chip mounted on the substrate and an encapsulation structure encapsulating the LED chip.

#FIG. 2 is a bottom view of the encapsulation structure of the LED package of FIG. 1.

#FIG. 3 is a schematic view for showing a method of manufacturing the capsulation of the LED package of FIG. 1.

#Embodiments of an LED package as disclosed are described in detail here with reference to the drawings.

#Referring to FIG. 1, an LED package 10 according to a first embodiment is shown. The LED package 10 includes a substrate 11, an LED chip 12 mounted on the substrate 11 and an encapsulation structure 17 enclosing the LED chip 12.

#The substrate 11 is made of thermally conductive and electrically insulating material such as epoxy, silicone, silicon oxide or a mixture thereof. The substrate 11 includes a main plate 118, and a first soldering pad 116 and a second soldering pad 117 mounted at two opposite sides of a bottom surface 111 of the main plate 118, respectively. In addition to the bottom surface 111, the main plate 118 further has a top surface 110 opposite to the bottom surface 111. A first locating hole 114 and a second locating hole 115 are defined in the main plate 118 of the substrate 11. Each of the first locating hole 114 and the second locating hole 115 extends through the main plate 118 of the substrate 11 along a height direction thereof, from the top surface 110 to the bottom surface 111. Each of the first soldering pad 116 and the second soldering pad 117 is flat. The first soldering pad 116 and the second soldering pad 117 are formed on the bottom surface 111 of the main plate 118 of the substrate 11 and separated from each other.