Reticles for use in forming implant masking layers and methods of forming implant masking layers

A method, comprising:

• forming a layer of photoresist material above a substrate comprised of a plurality of functional die and a plurality of incomplete die;
• performing a pattern transfer exposure process through an arrangement of multiple patterns on a reticle to transfer said patterns to a portion of a layer of photoresist material positioned above at least one of said functional die and at least one of said incomplete die;
• after performing said pattern transfer exposure process, performing a plurality of incomplete die exposure processes via an open feature formed on or through said reticle to expose substantially all of said photoresist material positioned above said plurality of incomplete die;
• and
• after performing said pattern transfer exposure process and said plurality of incomplete die exposure processes, performing at least one photoresist development process to remove said portions of said photoresist material positioned above said plurality of incomplete die.

A method, comprising:

• forming a layer of photoresist material above a substrate comprised of a plurality of functional die and a plurality of incomplete die;
• performing a plurality of incomplete die exposure processes via an open feature formed on or through a reticle to expose substantially all of said photoresist material positioned above said plurality of incomplete die;
• after performing said plurality of incomplete die exposure processes, performing a pattern transfer exposure process through an arrangement of multiple patterns on said reticle to transfer said patterns to a portion of a layer of photoresist material positioned above at least one of said functional die and at least one of said incomplete die;
• and
• after performing said pattern transfer exposure process and said plurality of incomplete die exposure processes, performing at least one photoresist development process to remove said portions of said photoresist material positioned above said plurality of incomplete die.