Non-random array anisotropic conductive film (ACF) and manufacturing processes

A method for fabricating an electric device comprising:

• placing one of a plurality of conductive particles of narrow particle size distribution into a respective microcavity of a microcavity array of narrow cavity size distribution by employing a closed loop roll-to-roll continuous fluidic particle distribution process to entrap each of the respective ones of the plurality of conductive particles into a single microcavity on a temporary closed loop web including the step of placing the plurality of conductive particles into the array of microcavities using a contact push process;
• and
• transferring the plurality of conductive particles from the microcavity array on the temporary closed loop web to predefined locations in the adhesive layer, wherein a distance between the transferred adjacent conductive particles is greater than the percolation threshold corresponding to the plurality of conductive particles, wherein one or both of the narrow particle size distribution or the narrow cavity size distribution has a standard deviation of less than about 10%.