Deposition method and method for manufacturing light-emitting device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Koichiro Tanaka, Hisao Ikeda, Satoshi Seo
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AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Koichiro Tanaka, Hisao Ikeda, Satoshi Seo
Estimating the term…
An object is to provide a deposition method for smoothly obtaining desired pattern shapes of material layers and a method for manufacturing a light-emitting device while throughput is improved when a plurality of different material layers is stacked on a substrate. A material layer is selectively formed in advance in a position overlapped with a light absorption layer over a first substrate by pump feeding. Three kinds of light-emitting layers are deposited on one deposition substrate. This first substrate and a second substrate that is to be a deposition target substrate are arranged to face each other, and the light absorption layer is heated by being irradiated with light, whereby a film is deposited on the second substrate. Three kinds of light-emitting layers can be deposited with positional accuracy by performing only one position alignment before light irradiation.
A method for manufacturing a light-emitting device, comprising the steps of:
A method for manufacturing a light-emitting device, comprising the steps of:
Dependencies are inferred from the claim text.