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US 8,801,958 B2Granted
Titanium etchant composition and method of forming a semiconductor device using the same
AssigneesSamsung Electronics Co., Ltd., Samyoung Pure Chemicals Co., Ltd.
InventorsDong-Min Kang, Heon jin Park, Kyoochul Cho, Baiksoon Choi, Seunghyun Ahn, Jeong Kwon, JungIg Jeon
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Abstract
A titanium etchant composition and a method of forming a semiconductor device using the same, the titanium etchant composition including a titanium remover; a corrosion inhibitor; and a deionized water; wherein the corrosion inhibitor includes 5-aminotetrazole.
Claims7
A titanium etchant composition, consisting essentially of:
- a titanium remover;
- a corrosion inhibitor;
- and
- a deionized water;
- wherein:
- the corrosion inhibitor includes 5-aminotetrazole.
3 more elements
A titanium etchant composition, consisting essentially of:
- a titanium remover, the titanium remover containing at least one of ammonium fluoride, ammonium bifluoride, tetramethyl ammonium fluoride, and hydrofluoric acid;
- 5-aminotetrazole;
- and
- deionized water.
1 more element
Dependencies are inferred from the claim text.