Reduction of a process volume of a processing chamber using a nested dynamic inert volume

A substrate processing system comprising:

• a substrate processing chamber including a top wall, a bottom wall and side walls;
• a pedestal that is arranged inside the substrate processing chamber when the pedestal is located in a substrate loading position and when the pedestal is located in a substrate processing position, wherein the pedestal has a top surface and a bottom surface, and wherein a substrate is supported on the top surface of the pedestal;
• a lift actuator that is connected to the bottom wall of the substrate processing chamber and the bottom surface of the pedestal and that moves the pedestal between the substrate loading position and the substrate processing position;
• and
• an adjustable seal that is arranged between the bottom surface of the pedestal and the bottom wall of the substrate processing chamber, wherein the adjustable seal defines an expandable sealed volume between the bottom surface of the pedestal and the bottom wall of the substrate processing chamber,
• wherein when the pedestal is in the substrate processing position, the pedestal, the lift actuator, the processing chamber, and the adjustable seal define a first inert volume and the pedestal, the substrate processing chamber, and the adjustable seal define a first process volume,
• wherein when the pedestal is in the substrate loading position, the pedestal, the lift actuator, the substrate processing chamber, and the adjustable seal define a second inert volume and the pedestal, the substrate processing chamber, and the adjustable seal define a second process volume,
• wherein the second inert volume is less than the first inert volume and the second process volume is greater than the first process volume.