Methods for forming microlenses
AssigneeMattson Technology, Inc.
InventorsTinghao Frank Wang, Rao V. Annapragada, Cecilia Laura Quinteros, Linda Nancy Marquez, Steven M. Kennedy
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AssigneeMattson Technology, Inc.
InventorsTinghao Frank Wang, Rao V. Annapragada, Cecilia Laura Quinteros, Linda Nancy Marquez, Steven M. Kennedy
Estimating the term…
Methods for forming microlenses on a semiconductor substrate are provided. An inductively coupled plasma etch process using a process gas that includes a mixture of CF4 and CHF3 can be used to modify the lens shape of a plurality of microlens objects located on a semiconductor substrate to meet microlens specifications in terms of curvature, height, length, shape, and/or distance between adjacent microlens objects on the substrate. The inductively coupled plasma process can be performed in an inductively coupled plasma processing apparatus that includes a grounded Faraday shield to prevent any capacitive coupling during the plasma etching process to reduce sputtering of the microlens surface.
A method of forming microlenses on a substrate, comprising:
A method of forming microlenses on a semiconductor substrate, the method comprising:
Dependencies are inferred from the claim text.