Composite insulating layer and manufacturing method thereof
AssigneeChenming Mold Ind. Corp.
InventorsChuan-Li Cheng, Chao-Lun Liu, Chih-Feng Hsu
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Abstract
A composite insulating layer and a manufacturing method thereof. The composite insulating layer includes a socket substrate, a connection layer disposed on the socket substrate, a conductive metal layer disposed on the connection layer, an insulating metal layer disposed on the conductive metal layer, an insulating ceramic layer disposed on the insulating metal layer, and a electrodeposition layer disposed on the insulating ceramic layer. The composite insulating layer of the present invention can avoid the electromagnetic interference generated from the pins of the CPU and increase the stability of the CPU.
Claims10
A manufacturing method for a composite insulating layer comprising:
- disposing a connection layer with a material of titanium on a socket substrate with a material of resin or glass, wherein the socket substrate has a plurality of sockets for inserting pins of CPU;
- disposing a conductive metal layer on the connection layer;
- and
- disposing an electrodeposition insulating layer on the conductive metal layer,
- wherein the connection layer is connected between the socket substrate and the conductive metal layer.
Dependencies are inferred from the claim text.