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US 8,801,895 B2Granted
Semiconductor manufacturing equipment and manufacturing method of the same
AssigneeSpansion LLC
InventorHirotaka Inomata
Life of this patent
Estimating the term…
Abstract
A semiconductor manufacturing equipment includes a first chamber that has a first connection hole, a second chamber that has a second connection hole connected to the first connection hole of the first chamber, an O-ring that is provided between the first chamber and the second chamber so as to surround the first connection hole and the second connection hole, and a cover portion that covers a space between the first chamber and the second chamber.
Claims17
A semiconductor manufacturing equipment comprising:
- a first chamber comprising a first connection hole formed through a first wall;
- a second chamber comprising a second connection hole formed through a second wall, wherein the first and second connection holes are coupled by a cover portion wherein a thickness of the cover portion is greater on the side of the first chamber than on the side of the second chamber;
- and
- an O-ring that is provided between the first chamber and the second chamber so as to surround the first connection hole and the second connection hole, wherein the cover portion is configured to contact the first wall in the first connection hole and is spaced apart from the second wall in the second connection hole, to cover a space between the first chamber and the second chamber and shield the O-ring.
1 more element
A semiconductor manufacturing method comprising:
- providing an O-ring between a first chamber comprising a first connection hole formed through a first wall of said first chamber and a second chamber comprising a second hole formed through a second wall of said second chamber, whereby the O-ring is configured to surround the first connection hole and the second connection hole;
- and
- providing a cover portion to connect the first connection hole and the second connection hole and cover a space between the first chamber and the second chamber whereby the cover portion is configured to contact the first wall in the first connection hole and is spaced apart from the second wall in the second connection hole, to shield the O-ring wherein a thickness of the cover portion is greater on the side of the first chamber than on the side of the second chamber.
Dependencies are inferred from the claim text.