Autocatalytic plating bath composition for deposition of tin and tin alloys
AssigneeAtotech Deutschland GmbH
InventorsArnd Kilian, Jens Wegricht, Isabel-Roda Hirsekorn
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Abstract
An autocatalytic tin plating bath containing Sn2+ ions, Ti3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.
Claims13
An aqueous autocatalytic tin plating bath composition comprising a water-soluble source of Sn2+ ions, a water-soluble source of Ti3+ ions, at least one organic complexing agent and a stabilizing additive selected from the group consisting of compounds according to formula (1), formula (2) and mixtures thereof
- wherein R1, R2, R3, R4, R5, R6, R7 and R8 according to formula (1) and R9, R10, R11 and R12 according to formula (2) are independently selected from the group consisting of hydrogen, halogen, nitro, methyl, ethyl, 1-propyl, 2-propyl, phenyl, hydroxyl, sulfonate, phenyl sulfonate, amino, amido, and carboxylate, and R13 is selected from the group consisting of hydrogen and sulfonate.
Dependencies are inferred from the claim text.