Method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers

A method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers, the method comprising:

• providing a double-side processing apparatus including two rotating ring-shaped working disks and a rolling apparatus configured to rotate at least three carriers, each carrier including precisely one opening adapted to receive a respective one of the semiconductor wafers in a freely movable fashion, the carriers being arranged in the double-side processing apparatus and the openings being disposed in the carriers so as to satisfy the inequality:
• R/e·sin(π/N*)−r/e−1≦1.2
• where N* denotes a ratio of the round angle and an angle at which adjacent carriers are inserted into the rolling apparatus with the greatest distance with respect to one another, r denotes a radius of each opening for receiving a respective semiconductor wafer, e denotes a radius of a pitch circle around a midpoint of the carrier on which the opening is arranged, and R denotes a radius of the pitch circle on which the carriers move between the working disks by means of the rolling apparatus;
• disposing the semiconductor wafers between the two rotating ring-shaped working disks;
• and
• rotating the at least three carriers using the rolling apparatus so as to move the semiconductor wafers on a cycloidal trajectory between the working disks.