Camera module and method for manufacturing camera module
AssigneeKabushiki Kaisha Toshiba
InventorHirokazu Sekine
Life of this patent
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Abstract
Certain embodiments provide a camera module including a lens holder that holds a lens, a transparent substrate disposed below the lens in the lens holder, a driving-device, a substrate including a sensor unit, a driver IC, a plurality of external electrodes electrically connected to the sensor unit and the driver IC, and a wiring for the driving-device. The driving-device is a device which moves the lens in the vertical direction and which is disposed above the transparent substrate in the lens holder. The substrate is disposed below the transparent substrate in the lens holder. The driver IC is an IC which drives the driving-device and which is disposed at a rear side of the substrate. The wiring for the driving-device electrically connects the driving-device with the driver IC.
Claims18
A camera module comprising:
- a cylindrical lens holder including a lens inside thereof;
- a transparent substrate disposed below the lens in the lens holder, the transparent substrate having a circumferential surface which is in contact with an inner surface of the lens holder;
- a driving-device disposed above the transparent substrate and moving the lens in a vertical direction in the lens holder;
- a substrate disposed below the transparent substrate in the lens holder and having a sensor unit on a front surface thereof and wiring on a rear surface thereof and in which the sensor unit and the wiring are connected with each other by a penetrating electrode;
- a driver IC for the driving-device disposed at a rear side of the substrate and driving the driving-device;
- a plurality of external electrodes formed on the rear surface of the substrate and electrically connected to the wiring and the driver IC for the driving-device respectively;
- and
- a wiring for the driving-device electrically connecting the driving-device with the driver IC for the driving-device, the wiring for the driving-device being provided so as to pass between the circumferential surface of the transparent substrate and the inner surface of the lens holder,
- wherein the transparent substrate and the substrate form a solid-state image pickup device.
A method for manufacturing a camera module, the method comprising:
- forming an adhesive on a front surface of a transparent substrate of a solid-state image pickup device including a substrate which includes a sensor unit on a front surface thereof and a driver IC for a driving-device disposed at a rear side thereof and the transparent substrate disposed above the substrate;
- disposing a cylindrical lens holder which includes a lens and the driving-device that moves the lens in a vertical direction and in which a fixing plate and a wiring for the driving-device that electrically connects the driving-device with the driver IC for the driving-device are provided on an inner surface thereof so that the fixing plated is in contact with the adhesive;
- adjusting a position of the lens holder by pressing the fixing plate into the adhesive so that a focal point of the lens corresponds to the sensor unit of the solid-state image pickup device;
- curing the adhesive after adjusting the position of the lens holder;
- and
- electrically connecting the driving-device with the driver IC for the driving-device via the wiring for the driving-device,
- wherein the position of the lens holder is adjusted by
- disposing the lens holder so that a focal point of the lens corresponds to a sensor unit of a test solid-state image pickup device, the test solid-state image pickup device including a substrate having the sensor unit on a front surface thereof and a transparent substrate disposed above the substrate,
- measuring a distance between a lower end surface of the lens holder and a reference surface of the test solid-state image pickup device if the focal point of the lens corresponds to the sensor unit of the test solid-state image pickup device,
- measuring a distance between a reference surface of the solid-state image pickup device and the front surface of the transparent substrate of the solid-state image pickup device, and
- disposing the lens holder at a desired position based on the distance between the lower end surface of the lens holder and the reference surface of the test solid-state image pickup device and a distance between the lower end surface of the lens holder and a reference surface of the solid-state image pickup device.
Dependencies are inferred from the claim text.