Light emitting device package and display device therewith
AssigneeLG Innotek Co., Ltd.
InventorSang Jae Park
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AssigneeLG Innotek Co., Ltd.
InventorSang Jae Park
Estimating the term…
An embodiment discloses a light emitting device package including a first lead frame and a second lead frame disposed spaced from each other, a light emitting device disposed on the first lead frame, and a reflective sidewall disposed on the first lead frame and the second lead frame to surround the light emitting device, wherein a portion of the reflective sidewall has a height higher than the other portion of the reflective sidewall.
A light emitting device package comprising:
A light emitting device package comprising:
A display device comprising:
The display device according to 18, wherein the protrusion is disposed on the substrate parallel to an incident surface of the light guide plate.
Dependencies are inferred from the claim text.
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Packages: containers
Packages: optical field-shaping means, e.g. lenses
Optical field-shaping means, e.g. lenses: reflecting means
Of bond wires: between a chip and a stacked lead frame, conducting package substrate or heat sink
About 5 years 11 months of term left · ends 26 Sep 2032 (estimated)
This application claims priority under 35 U.S.C §119 to Korean Patent Application No. 10-2011-0064972, filed in Korea on Jun. 30, 2011, which is hereby incorporated in its entirety by reference as if fully set forth herein.
Embodiments relate to a light emitting device package.
The light emitting device, such as a light emitting diode of III-V group or II-VI group compound semiconductor or a laser diode, can produce various colors, such as red, blue, and ultra-violet owing to development of the thin film growth technology and device materials therefor, as well as a white color of good efficiency by using a fluorescent material or mixing colors, and is advantageous in that the light emitting device has power consumption lower than the present light sources, such as a fluorescent light and an incandescent light, a semi-permanent lifetime, fast response speed, and safety, and is environment friendly.
Arrangements and embodiments may be described in detail with reference to the following drawings in which like reference numerals refer to like elements and wherein:
FIG. 1 illustrates a perspective view of a light emitting device package in accordance with one embodiment, seen from above.
FIG. 2 illustrates a perspective view of the light emitting device package in FIG. 1, seen from below.
Hereinafter, embodiments will be described with reference to the annexed drawings. In description of embodiments, if it is described that a layer (a film), a region, a pattern, or a structure is formed “on” or “under” a substrate, a layer (a film), a region, a pad, or a pattern, the “on”, or “under” implies that the layer (the film), the region, the pattern, or the structure is formed “on” or “under” the substrate, the layer (the film), the region, the pad, or the pattern directly or indirectly with other substrate, layer (film), region, pad, or pattern, disposed therebetween. And, a reference on the “on” or “under” is the drawing.
A size shown in a drawing is exaggerated, omitted or shown schematically for convenience or clarity of description. And, the size of an element may not be shown to scale, perfectly. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. A light emitting device package, a lighting device therewith, and a display device therewith will be described with reference to the attached drawings.
FIG. 1 illustrates a perspective view of a light emitting device package 100 in accordance with one embodiment, seen from above, FIG. 2 illustrates a perspective view of the light emitting device package 100 in FIG. 1, seen from below, FIG. 3 illustrates a plan view of the light emitting device package 100 in FIG. 1, FIG. 4 illustrates a section of the light emitting device package 100 in FIG. 1 across a line A-A′, and FIG. 5 illustrates a section of the light emitting device package 100 in FIG. 1 across a line B-B′.