Contact force sensor package, blood pressure meter with the same, and method for fabricating the contact force sensor package
AssigneeSamsung Electronics Co., Ltd.
InventorJong-pal Kim
Life of this patent
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AssigneeSamsung Electronics Co., Ltd.
InventorJong-pal Kim
Estimating the term…
A contact force sensor package includes a substrate layer having a vibration detection unit and a pair of first junction pads that are electrical connection ports which are provided on an upper surface of the substrate layer, a flexible circuit substrate layer having a pair of second junction pads provided at a position corresponding to the first junction pads and electrically connected to the first junction pad, a vibration transfer unit having one side contacting the vibration detection unit and the other side contacting a human body and transferring a sphygmus wave of the human body to the vibration detection unit, and an adhesion layer formed between the substrate layer and the flexible circuit substrate layer to reinforce a junction force between the substrate layer and the flexible circuit substrate layer, the adhesion layer being not formed in an area overlapping at least the vibration transfer unit.
A contact force sensor package comprising:
A blood pressure meter comprising:
A method for fabricating a contact force sensor package, the method comprising:
Dependencies are inferred from the claim text.