Multilayer printed wiring board and manufacturing method thereof
AssigneeIbiden Co., Ltd.
InventorYouhong Wu
Life of this patent
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Abstract
A method of manufacturing a multi-layer printed wiring board including forming a core substrate, forming a first interlayer insulation layer over the core substrate, forming a first filled via in the first interlayer insulation layer, the first filled via having a bottom portion having a first diameter, forming a second interlayer insulation layer over the first interlayer insulation layer, and forming a second filled via in the second interlayer insulation layer, the second filled via having a bottom portion having a second diameter smaller than the first diameter.
Claims20
A method of manufacturing a multi-layer printed wiring board, comprising:
- forming a core substrate;
- forming a first interlayer insulation layer over the core substrate;
- forming a first filled via in the first interlayer insulation layer such that the first filled via has a bottom portion having a first diameter;
- forming a first coarse surface on the first filled via such that an entire exposed surface of the first filled via has the first coarse surface;
- forming a second interlayer insulation layer over the first interlayer insulation layer;
- forming a second filled via in the second interlayer insulation layer such that the second filled via has a bottom portion having a second diameter smaller than the first diameter;
- and
- forming a second coarse surface on the second filled via such that an entire exposed surface of the second filled via has the second coarse surface.
Dependencies are inferred from the claim text.