Method for conditioning a substrate surface for forming an electronic device thereon and resultant device
AssigneeCarestream Health, Inc.
InventorsTimothy J. Tredwell, Roger S. Kerr
Life of this patent
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Abstract
A method for forming an electronic device on a flexible substrate conditions a surface of the flexible substrate to increase its malleability and to provide a conditioned substrate surface. A master surface is impressed against the conditioned substrate surface. The master surface is then released from the conditioned substrate surface, thereby forming a circuit-side surface on the substrate. The electronic device is then formed on the circuit-side surface. The substrate may be supported on a carrier during the method.
Claims18
A method for forming an electronic device on a flexible substrate comprising:
- conditioning a surface of the flexible substrate to increase its malleability and provide a conditioned substrate surface;
- impressing a master surface including a surface roughness less than 50 nanometers against the conditioned flexible substrate surface;
- releasing the master surface from the conditioned substrate surface, thereby forming a circuit-side surface including a surface roughness less than 50 nanometers on the substrate;
- and
- forming the electronic device on the circuit-side surface, wherein said forming comprises depositing and patterning materials to form a thin-film transistor device on the circuit-side surface.
A method for forming an electronic device on a flexible substrate comprising:
- conditioning a surface of the flexible substrate to increase its malleability and provide a conditioned substrate surface;
- impressing a master surface against the conditioned flexible substrate surface;
- releasing the master surface from the conditioned substrate surface, thereby forming a circuit-side surface including a surface roughness less than 50 nanometers on the substrate;
- and
- forming the electronic device on the circuit-side surface, wherein said forming comprises depositing and patterning materials to form a thin-film transistor device on the circuit-side surface, where the master surface is featured, and where a surface roughness of features on the circuit-side surface include the surface roughness less than 50 nanometers.
Dependencies are inferred from the claim text.