Measuring critical dimensions of a semiconductor structure
AssigneeKLA-Tencor Corporation
InventorsJohn Hench, Daniel Wack, Edward Ratner, Yaoming Shi, Andrei Veldman
Life of this patent
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AssigneeKLA-Tencor Corporation
InventorsJohn Hench, Daniel Wack, Edward Ratner, Yaoming Shi, Andrei Veldman
Estimating the term…
One embodiment relates to a method of model-based optical metrology. An area of a geometrical structure of dispersive materials on a substrate is illuminated with polarized incident electromagnetic radiation using an illuminator of a scatterometer apparatus. Spectral components of the incident electromagnetic radiation reflected from the area are measured using a detector of the scatterometer apparatus. Using a computer for the scatterometer apparatus, parameter values are determined that minimize an objective function which represents a difference between the measured spectral components and computed spectral components based on a parameterized model of the geometrical structure. Steps for determining the parameter values that minimize the objective function include: computing a solution to state equations driven by a function representing the incident electromagnetic radiation, and computing a solution to an adjoint to the state equations. Other embodiments and features are also disclosed.
A method of model-based optical metrology to measure a critical dimension of a grating layer, the method comprising:
An apparatus for optical metrology for measuring a critical dimension of a grating layer, the apparatus comprising:
A method for estimating a critical dimension of a grating layer from spectroscopic measurements, the method comprising:
Dependencies are inferred from the claim text.