Detector modules and methods of manufacturing
AssigneeGeneral Electric Company
InventorsWen Li, Naresh Kesavan Rao, Abdelaziz Ikhlef, Jeffrey Kautzer
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Abstract
Detector modules and methods of manufacturing are provided. One detector module includes a detector having a silicon wafer structure formed from a first layer having a first resistivity and a second layer having a second resistivity, wherein the first resistivity is greater than the second resistivity. The detector further includes a photosensor device provided with the first layer on a first side of the silicon wafer and one or more readout electronics provided with the second layer on a second side of the silicon wafer, with the first side being a different side than the second side.
Claims20
A detector comprising:
- a silicon wafer formed from a first layer having a first resistivity and a second layer having a second resistivity, wherein the first resistivity is greater than the second resistivity;
- a photosensor device provided with the first layer on a first side of the silicon wafer;
- and
- one or more readout electronics provided with the second layer on a second side of the silicon wafer, the first side being a different side than the second side.
An imaging system comprising:
- an x-ray source for generating x-rays;
- a detector for detecting x-rays generated by the x-ray source after passing through an object, the detector comprising a plurality of modules having detector elements formed from (i) a silicon wafer having a first layer with a first resistivity and a second layer having a second resistivity, wherein the first resistivity is greater than the second resistivity, (ii) a photosensor device provided with the first layer on a first side of the silicon wafer and (iii) one or more readout electronics provided with the second layer on a second side of the silicon wafer, the first side being a different side than the second side, wherein digital signals are output from the detector elements;
- and
- a processor for reconstructing an image of the object using the digital signals.
A method for forming a detector module, the method comprising:
- fabricating a photosensor array on a first side of a silicon wafer, wherein the silicon wafer comprises a plurality of layers each having a different resistivity;
- fabricating readout electronics on a second side of the silicon wafer opposite the first side;
- and
- forming a conductive via through the silicon wafer interconnecting the photosensor array and the readout electronics.
Dependencies are inferred from the claim text.