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US 8,797,759 B2Granted
Electronic module and communication apparatus
AssigneeMurata Manufacturing Co., Ltd.
InventorHiroki Watanabe
Life of this patent
Estimating the term…
Abstract
An electronic module with excellent electrical characteristics includes an electronic component, a mount board, signal electrodes, a ground electrode, and an insulating layer. The electronic component is mounted on a first main surface of the mount board. The signal electrodes and the ground electrode are located on a second main surface of the mount board. The insulating layer is arranged so as to cover a portion of the second main surface of the mount board. The insulating layer is arranged so as not to cover end portions of the signal electrodes that face the ground electrode.
Claims9
An electronic module comprising:
- an electronic component that includes a signal terminal and a ground terminal;
- a mount board that includes a first main surface and a second main surface, the electronic component being mounted on the first main surface;
- a signal electrode that is located on the second main surface of the mount board and that is connected to the signal terminal;
- a ground electrode that is located on the second main surface of the mount board and that is connected to the ground terminal;
- and
- an insulating layer that is arranged so as to cover a portion of the second main surface of the mount board;
- wherein
- the insulating layer is arranged so as not to cover an end portion of the signal electrode that faces the ground electrode.
5 more elements
Dependencies are inferred from the claim text.