Mask inspection method and mask inspection apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsTakeshi Yamane, Tsuneo Terasawa
Life of this patent
Estimating the term…
Loading patent…
AssigneeKabushiki Kaisha Toshiba
InventorsTakeshi Yamane, Tsuneo Terasawa
Estimating the term…
According to one embodiment, a method of detecting a defect of a semiconductor exposure mask includes acquiring a background intensity from a surface height distribution of the mask, acquiring a standard background intensity distribution from the background intensity, making light of an arbitrary wavelength incident on the mask, and acquiring an image at a position of interest of the mask, acquiring background intensity raw data, based on a signal intensity of the acquired image at the position of interest and a mean value of image intensity data in a peripheral area of the position of interest, finding a correction coefficient of the signal intensity, based on a ratio of the background intensity raw data to the standard background intensity distribution, correcting the signal intensity by multiplying the signal intensity.
A method of detecting a defect of a semiconductor exposure mask, comprising:
An apparatus for detecting a defect of a semiconductor exposure mask, the apparatus comprising:
Dependencies are inferred from the claim text.