MEMS switch with reduced dielectric charging effect
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Hua Chu, Chung-Hsien Lin, Chun-Wen Cheng
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Abstract
The present disclosure provides in one embodiment, a semiconductor device that includes a MEMS switch having a substrate, a first dielectric layer disposed above the substrate, and a bottom signal electrode, a bump, and a bottom actuation electrode disposed above the first dielectric layer. The MEMS switch further includes a second dielectric layer enclosing the bottom signal electrode, and a movable member including a top signal electrode disposed above the bottom signal electrode and a top actuation electrode disposed above the bottom actuation electrode and the bump, wherein the top actuation electrode is electrically coupled to the bump. A method of fabricating a MEMS switch is also disclosed.
Claims20
A micro-electro-mechanical systems (MEMS) switch, comprising:
- a substrate;
- a first dielectric layer disposed above the substrate;
- a bottom signal electrode, a bump, and a bottom actuation electrode disposed above the first dielectric layer;
- a second dielectric layer enclosing the bottom signal electrode;
- and
- a movable member including a top signal electrode disposed above the bottom signal electrode and a top actuation electrode disposed above the bottom actuation electrode and the bump, wherein the top actuation electrode is electrically coupled to the bump, and
- at least one support member that comprises the first dielectric layer and is directly below the top actuation electrode.
A micro-electro-mechanical systems (MEMS) switch, comprising:
- a substrate;
- a first dielectric layer disposed above the substrate;
- a bottom signal electrode disposed between two bumps, between two bottom actuation electrodes, and above the first dielectric layer between the at least two support members;
- a second dielectric layer enclosing the bottom signal electrode;
- a movable member including a top signal electrode disposed above the bottom signal electrode and disposed between two top actuation electrodes, and
- at least two support members that comprise the first dielectric layer and are each directly below a respective top actuation electrode;
- wherein each of the top actuation electrodes is disposed above a respective bottom actuation electrode and a respective bump, and
- wherein each of the top actuation electrodes is electrically coupled to the respective bump by at least one via and one line through the first dielectric layer.
A micro-electro-mechanical systems (MEMS) switch, comprising:
- a substrate;
- a first dielectric layer above the substrate;
- a bottom signal electrode, a bump, and a bottom actuation electrode above the first dielectric layer;
- a second dielectric layer enclosing the bottom signal electrode;
- a movable member including a top signal electrode disposed above the bottom signal electrode and a top actuation electrode disposed above the bottom actuation electrode and the bump;
- a conductive component for electrically coupling the top actuation electrode to the bump;
- and
- at least one support member that comprises the first dielectric layer and is directly below the top actuation electrode.
Dependencies are inferred from the claim text.