Distributed coupler with first line on substrate and second line in package supporting substrate
AssigneeSTMicroelectronics (Tours) SAS
InventorsHilal Ezzeddine, Claire Laporte
Life of this patent
Estimating the term…
Abstract
A distributed coupler including a first line intended to convey a radio signal between its two ends and a second line intended to sample, by coupling, part of the signal, wherein: one of the lines is formed on an insulating substrate; and the other line is formed in a lead frame supporting the substrate, one line being above the other.
Claims17
A distributed coupler comprising a first line intended to convey a radio signal between its two ends and a second line intended to sample, by coupling, part of said signal, wherein:
- one of the lines is formed on an insulating substrate;
- and
- the other line is formed in a lead frame supporting the substrate, one line being above the other, wherein ground planes are formed approximately above each other on the substrate and in the lead frame.
A distributed coupler comprising:
- a first conductive line configured to carry a radio frequency signal;
- and
- a second conductive line configured to carry a part of the radio frequency signal coupled from the first conductive line, one of the first and second conductive lines being formed on a substrate, the other of the first and second conductive lines being formed in a package, and the substrate being mounted in the package such that the first and second conductive lines are positioned for coupling therebetween, wherein the package includes a lead frame and wherein the substrate is mounted on the lead frame.
A distributed coupler comprising:
- a package having a first conductive line formed therein;
- a substrate having a second conductive line formed thereon, wherein the substrate is mounted in the package such that the first and second conductive lines are positioned for radio frequency coupling therebetween, wherein the package includes a lead frame and wherein the substrate is mounted on the lead frame.
A method of making a distributed coupler, comprising:
- forming a first conductive line in a package;
- forming a second conductive line on an insulating substrate;
- and
- mounting the insulating substrate in the package with the first conductive line positioned relative to the second conductive line for radio frequency coupling therebetween, wherein the package includes a lead frame and wherein the insulating substrate is mounted on the lead frame.
Dependencies are inferred from the claim text.