Prober and method of inspecting semiconductor chip

A prober comprising:

• a probe card that includes a support board and a probe attached to the support board;
• a stage on which a measurement wafer, that includes a first semiconductor chip and a second semiconductor chip, is mounted;
• a camera provided over the probe card to observe an electrode pad of the first semiconductor chip and to find a position of a mark of a probe left on a first electrode pad of the first semiconductor chip, a distance between the probe and a center of a field of view of the camera being an integer multiple of a size of the first semiconductor chip;
• a moving unit that moves a position of the stage relative to the probe card;
• and
• a controller that acquires an image signal from the camera and controls the moving unit, that measures an electrical characteristics of the second semiconductor chip by contacting the probe to a second electrode pad of the second semiconductor chip, and that controls the moving unit to correct the position of the stage on the basis of a result of an observation of the mark of the probe left on the first electrode pad with the camera.