Positioning and socketing for semiconductor dice
AssigneeIntel Corporation
InventorsMichael L. Rutigliano, Eric J. M. Moret, David Shia
Life of this patent
Estimating the term…
Abstract
Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.
Claims21
A device comprising,
- a housing having an end mounted on an air bearing plate,
- an actuation member located within the housing and capable of movement along a first axis within the housing,
- at least one air bearing in the housing and capable of separating the actuation member from an inner side of the housing,
- a first motor mounted on the housing and operably connected to the actuation member and capable of causing the actuation member to move along the first axis,
- one or more manipulators each movably attached at a first end to the air bearing plate and movably attached at a second end to a proximate surface,
- a testing interface wherein the testing interface is capable of forming electrical contacts with a die mounted on the actuation member and wherein the testing interface faces a region of the actuation member that is capable of holding a die, and
- an optical system wherein the optical system comprises optics capable of reflecting an image of a die mounted on the actuation member and an image of the testing interface onto an imaging device capable of detecting the image of the die and the image of the testing interface.
A device comprising,
- an enclosed space wherein the enclosed space comprises a thermal fluid,
- a housing that partially surrounds the enclosed space,
- a membrane wherein the membrane is attached to the housing that partially surrounds the enclosed space, wherein the membrane is capable of deflecting into the enclosed space, and wherein the membrane comprises a first region having a greater thickness than a second region of the membrane surrounding the first region, and
- an interface region comprising probes wherein the probes are capable of making electrical contact with an interface presented by a die wherein, the interface region is located on the region of the membrane having a greater thickness, and wherein the probes each comprise a flexible arm and a probe stop configured such that when flexed a free end of the flexible arm is capable of contacting the probe stop.
Dependencies are inferred from the claim text.