Ultra-slim sensor device and manufacturing method thereof
AssigneeLattron Co. Ltd.
InventorsChung Kook Lee, Young Seong Wang, Cheol Jin Jeong
Life of this patent
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Abstract
An ultra-slim sensor device, comprising: a sensor element; lead wires (or lead frames) connected to the sensor element; a support for protecting the sensor element and the lead wires disposed therein; and upper and lower films disposed on upper and lower sides of the sensor element, the lead wires and the support to insulate them, wherein a thickness of the support is greater than that of the sensor element in order to protect the sensor element and the lead wires from external shocks, and the support gradually becomes thin toward the end thereof such that the upper and lower films come into contact with each other in order to remove a space between the upper and lower films.
Claims6
A sensor device, comprising:
- a sensor element;
- lead wires connected to the sensor element;
- a support surrounding the sensor element with the lead wires and exposing an upper surface and a lower surface of the sensor element, wherein the support protects the sensor element and the lead wires;
- and
- an upper film disposed on the upper surface of the sensor element and a lower film disposed on the lower surface of the sensor element and on a lower surface of the support,
- wherein the support has an upper surface of a height greater than a height of the upper surface of the sensor element in order to protect the sensor element and the lead wires from external shocks, and
- wherein the support gradually becomes thinner toward an end of the support along an extended direction of the lead wires such that the upper and lower films come into contact with each other in order to remove a space between the upper film and lower film.
A method of manufacturing a sensor device, comprising:
- connecting a sensor element with lead wires;
- disposing the sensor element connected with the lead wires inside a support, wherein the support exposes an upper surface and a lower surface of the sensor element;
- disposing an upper film on an upper surface and a lower film on a lower surface of the support to cover the sensor element disposed inside the support;
- and
- pressing the upper film using a press at a temperature of 100-250° C.,
- wherein the upper surface of the support has a height greater than a height of the upper surface of the sensor element in order to protect the sensor element and the lead wires from external shocks, and
- wherein the support gradually becomes thinner toward an end of the support along an extended direction of the lead wires such that the upper and lower films come into contact with each other in order to remove a space from between the upper film and lower film.
Dependencies are inferred from the claim text.