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US 8,796,868 B1Granted
Semiconductor layout
AssigneeMarvell International Ltd.
InventorsThomas Ngo, Shiann-Ming Liou
Life of this patent
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Abstract
Apparatuses and methods for an improved semiconductor layout are described herein. Embodiments of the present invention provide a microelectronic device including a microelectronic die and one or more redistribution paths formed thereon for electrically interconnecting at least one bond pad with an exposed portion of the redistribution path. The redistribution paths, bond pads, and exposed portions may be configured to result in the device having a width narrowed by at least the width of the bond pads due to their absence on at least one edge.
Claims13
An apparatus comprising:
- a die;
- a metal layer formed over the die;
- a plurality of redistribution paths formed from the metal layer;
- a passivation layer formed over the metal layer and over the plurality of redistribution paths, the passivation layer having an opening, in which the opening is located along a right edge of the apparatus to expose a portion of the metal layer;
- and
- a plurality of bond pads disposed along the top edge of the apparatus, wherein the plurality of bond pads are exposed to external bonding and the top edge is substantially perpendicular to the right edge;
- wherein a particular redistribution path of the plurality of redistribution paths electrically interconnects the portion of the metal layer exposed by the opening to a particular bond pad of the plurality of bond pads that is disposed along the top edge of the apparatus,
- wherein the particular bond pad is electrically interconnected to a first bonding finger of a plurality of bonding fingers of a leadframe via a first wire and the particular bond pad is formed on the particular redistribution path, and
- wherein the portion of the metal layer exposed by the opening is coupled to a second bonding finger of the plurality of bonding fingers via a second wire such that the particular bond pad is electrically interconnected to the second bonding finger via the particular redistribution path.
6 more elements
A package assembly comprising:
- a support structure;
- an apparatus mounted onto the support structure;
- a die;
- a metal layer formed over the die;
- a redistribution path formed from the metal layer;
- a passivation layer formed over the metal layer and over the redistribution path, the passivation layer having an opening in which the opening is located along a left edge of the apparatus, the opening to expose a portion of the metal layer, the portion of the metal layer exposed by the opening being positioned along the left edge of the apparatus, the left edge of the apparatus being substantially perpendicular to a top edge of the apparatus;
- and
- a plurality of bond pads disposed along the top edge of the apparatus, the plurality of bond pads being exposed to external bonding;
- wherein the redistribution path electrically interconnects the portion of the metal layer exposed by the opening with a particular bond pad of the plurality of bond pads disposed along the top edge of the apparatus,
- wherein the particular bond pad is electrically interconnected to a first bonding finger of a plurality of bonding fingers of a leadframe in the support structure via a first wire and the particular bond pad is formed on the redistribution path, and
- wherein the portion of the metal layer exposed by the opening is coupled to a second bonding finger of the plurality of bonding fingers via a second wire such that the particular bond pad is electrically interconnected to the second bonding finger via the redistribution path.
8 more elements
Dependencies are inferred from the claim text.