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US 8,796,865 B1Granted
RFID tags with bumped substrate, and apparatuses and methods for making
AssigneeImpinj, Inc.
InventorsJay M. Fassett, Ronald A. Oliver, Ronald L. Koepp, Steven I. Mozsgai, Ernest Allen, III
Life of this patent
Estimating the term…
Abstract
Radio Frequency Identification (RFID) tags are provided, along with apparatuses and methods for making. In some embodiments, the RFID tags include an RFID tag chip that is attached to an inlay and/or a strap. The inlay or strap has one or more contact bumps formed thereon. In some of these embodiments, the RFID tag chip includes pads for electrical contacts, but not chip-bumps, thanks to the contact bump.
Claims14
A Radio Frequency Identification (RFID) tag, comprising:
- a substantially planar substrate with at least two contacts and at least two alignment bumps, wherein the at least two alignment bumps are raised from a plane of the substrate and do not overlap with the at least two contacts;
- an RFID tag chip with at least two pads, the tag chip aligned on the substrate by the alignment bumps such that the pads electrically connect to the contacts;
- and
- an antenna formed on the substrate and electrically connected to the pads.
1 more element
A Radio Frequency Identification (RFID) tag, comprising:
- a substantially planar substrate with at least two contacts and at least two alignment bumps raised from a plane of the substrate;
- an RFID tag chip with at least two pads, the tag chip aligned on the substrate by the alignment bumps such that the pads electrically connect to the contacts and the alignment bumps are positioned outside a perimeter of the tag chip;
- and
- an antenna formed on the substrate and electrically connected to the pads.
1 more element
Dependencies are inferred from the claim text.