Flip chip bonded semiconductor device with shelf
AssigneeSpansion LLC
InventorsNaomi Masuda, Koji Taya
Life of this patent
Estimating the term…
Abstract
The semiconductor device according to the present invention has a planar semiconductor chip having projecting connection terminals provided on one surface thereof. A shelf is provided where a peripheral edge of a surface of the semiconductor chip opposite one surface thereof onto which connection terminals are provided is removed. This makes it possible to secure a larger volume of the fillet portion of the underfill, thereby helping improve the function of preventing the rising up of the excess underfill by providing a shelf in the semiconductor chip.
Claims14
A semiconductor device comprising a planar semiconductor chip, the planar semiconductor chip comprising:
- a substrate;
- an underfill disposed on the substrate;
- a wafer flip-chip bonded onto the substrate, the wafer comprising:
- a first surface mounted to the underfill;
- a second surface, the second surface being opposite to the first surface;
- and
- a plurality of protruding connection terminals disposed on the first surface,
- wherein the first surface extends beyond the second surface to form a shelf,
- further wherein, the shelf is configured to substantially prevent an excess portion of the underfill material from coating a plurality of side surfaces of the wafer.
Dependencies are inferred from the claim text.