Semiconductor package having support member
AssigneeSamsung Electronics Co., Ltd.
InventorsHyun-jin Kim, Jong-keun Ahn, Sun-Pil Youn
Life of this patent
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Abstract
Semiconductor packages including a substrate, a plurality of first semiconductor chips stacked on the substrate, a second semiconductor chip interposed between the substrate and a lowermost semiconductor chip among the first semiconductor chips, and a supporting member disposed between the substrate and the lowermost semiconductor chip among the first semiconductor chips to support the first semiconductor chips, may be provided. The supporting member may include a passive element such as a capacitor, a resistor, or an inductor. By including the supporting member, the semiconductor packages may achieve a smaller planar size and have an improved tolerance for subsequent interconnections.
Claims20
A semiconductor package comprising
- a package substrate;
- a plurality of first semiconductor chips stacked on the package substrate, the first semiconductor chips stacked on each other;
- a second semiconductor chip between the package substrate and a lowermost semiconductor chip among the first semiconductor chips;
- and
- a supporting member between the package substrate and the lowermost semiconductor chip among the first semiconductor chips, the supporting member configured to support the first semiconductor chips and including a passive element.
A semiconductor package comprising
- a package substrate;
- a plurality of first semiconductor chips stacked on the package substrate, the first semiconductor chips stacked on each other;
- a supporting member between the package substrate and a lowermost semiconductor chip among the first semiconductor chips or between vertically adjacent semiconductor chips among the first semiconductor chips, the supporting member configured to support at least one of the first semiconductor chips and including a passive element;
- and
- a second semiconductor chip at a same level with the supporting member.
Dependencies are inferred from the claim text.