Semiconductor device
AssigneeRenesas Electronics Corporation
InventorsYuji Tada, Tsuyoshi Hirakawa, Hironori Nakamura, Takayuki Kurokawa
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Abstract
A semiconductor device includes a substrate, a multi-layer wiring layer formed on the substrate, and including a signal line and ground lines extending above the signal line, one of the ground lines extending toward a direction in a layer and another one of the ground lines extending from the one of the ground lines toward another direction in the layer, a first pad on the multi-layer wiring layer, and a redistribution layer formed on the multi-layer wiring layer, including a second pad, a redistribution line coupling the first pad and the second pad, and an insulation film covering the redistribution line.
Claims8
A semiconductor device, comprising:
- a substrate;
- a multi-layer wiring layer formed on the substrate, and including a signal line and ground lines extending above the signal line, one of the ground lines extending toward a direction in a layer and another one of the ground lines extending from the one of the ground lines toward another direction in said layer;
- a first pad on the multi-layer wiring layer;
- and
- a redistribution layer formed on the multi-layer wiring layer, including a second pad, a redistribution line coupling the first pad and the second pad, and an insulation film covering the redistribution line.
Dependencies are inferred from the claim text.